VT-464 LT Laminate/Prepreg

UL Approval: E214381 Version: 03/02/2025 /130

Storage Condition & Shelf Life

Prepreg Laminate
Storage Condition Temperature Below 23℃ (73℉) Below 5℃ (41℉) Room
Relative Humidity Below 55% / /
Shelf Life 3 Months 6 Months 24 Months (airproof)

Prepreg exceeding shelf life should be retested.

Precautions in Handling

  • Laminate should be stored flat in a cool dry environment. Avoid bending or scratching the laminate surface.
  • Prepreg should be stored flat in a cool dry controlled environment 23ºC or less and 50% RH or less. Extended storage of prepreg should be at a reduced temperature of 5ºC.
  • Open bags of prepreg must be resealed. Prepreg should not be exposed to open environments for more than 8 hours total cumulatively under the above conditions or as agreed upon between user and supplier.
  • A first-in-first-out inventory system and a method to track material lot numbers through PCB processing and delivery of finished circuits is recommended.

 

Designing and Inner Layer Process

  • Before feed please baking to remove any absorbed moisture or surface moisture especially for thinner core.A racked bake at 150 ºC for 120 minutes is preferred. 

  • Oxide Alternative is preferred & recommended over the other oxide chemistry for the advanced boards fabrications, especially for lead free and high layer count applications. 
  • Holding time between brown oxide and press process: best control within 24 hours.

Prepreg Availability

Dk Values are for impedance design

Prepreg Type R/C (%) Delivered Thickness Dk Df
(μm) @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz
1027 73% 40 3.63 3.58 3.58 3.54 3.50 0.0066 0.0069 0.0074 0.0084 0.0089
75% 45 3.59 3.54 3.54 3.50 3.45 0.0067 0.0070 0.0075 0.0085 0.0090
1037 75% 50 3.59 3.54 3.54 3.50 3.45 0.0067 0.0070 0.0075 0.0085 0.0090
77% 55 3.55 3.50 3.50 3.46 3.44 0.0068 0.0071 0.0076 0.0086 0.0091
1067 72% 60 3.66 3.61 3.61 3.57 3.53 0.0065 0.0068 0.0073 0.0083 0.0088
74% 65 3.61 3.56 3.56 3.52 3.48 0.0066 0.0069 0.0074 0.0084 0.0089
76% 72 3.57 3.52 3.52 3.48 3.43 0.0067 0.0070 0.0075 0.0085 0.0090
1078 66% 76 3.70 3.65 3.65 3.61 3.57 0.0062 0.0065 0.0070 0.0080 0.0085
69% 84 3.68 3.63 3.63 3.59 3.55 0.0063 0.0066 0.0071 0.0081 0.0086
72% 95 3.66 3.61 3.61 3.57 3.53 0.0065 0.0068 0.0073 0.0083 0.0088
2113 59% 100 3.81 3.76 3.76 3.71 3.66 0.0057 0.0060 0.0065 0.0075 0.0080
2116 53% 112 3.95 3.90 3.90 3.85 3.80 0.0054 0.0057 0.0062 0.0072 0.0077
55% 119 3.90 3.85 3.85 3.80 3.75 0.0055 0.0058 0.0063 0.0073 0.0078
57% 125 3.85 3.80 3.80 3.76 3.72 0.0056 0.0059 0.0064 0.0074 0.0079
59% 136 3.81 3.76 3.76 3.71 3.66 0.0057 0.0060 0.0065 0.0075 0.0080
7628 48% 192 4.10 4.05 4.05 4.00 3.95 0.0051 0.0054 0.0059 0.0069 0.0074

Laminate Availablity

Dk Values are for impedance design

Laminate Thickness (μm) Glass Style Resin Content Dk Df
(μm) (mil) @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz
30 1.2 1027x1 65% 3.71 3.67 3.67 3.62 3.57 0.0062 0.0065 0.0070 0.0080 0.0085
50 2.0 1067x1 66% 3.70 3.65 3.65 3.61 3.57 0.0062 0.0065 0.0070 0.0080 0.0085
60 2.5 1078x1 59% 3.81 3.76 3.76 3.71 3.66 0.0057 0.0060 0.0065 0.0075 0.0080
80 3.0 1078x1 66% 3.70 3.65 3.65 3.61 3.57 0.0062 0.0065 0.0070 0.0080 0.0085
90 3.5 1086x1 66% 3.70 3.65 3.65 3.61 3.57 0.0062 0.0065 0.0070 0.0080 0.0085
100 4.0 2113x1 58% 3.83 3.78 3.78 3.74 3.70 0.0056 0.0059 0.0064 0.0074 0.0079
1067x2 66% 3.70 3.65 3.65 3.61 3.57 0.0062 0.0065 0.0070 0.0080 0.0085
110 4.5 2116x1 52% 3.98 3.93 3.93 3.88 3.83 0.0054 0.0057 0.0062 0.0072 0.0077
130 5 1078x2 59% 3.81 3.76 3.76 3.71 3.66 0.0057 0.0060 0.0065 0.0075 0.0080
2116x1 56% 3.88 3.83 3.83 3.78 3.73 0.0055 0.0058 0.0063 0.0073 0.0078
150 6 1078x2 65% 3.71 3.67 3.67 3.62 3.57 0.0062 0.0065 0.0070 0.0080 0.0085
180 7 7628x1 43% 4.22 4.17 4.12 4.07 4.02 0.0049 0.0052 0.0057 0.0067 0.0072
200 8 2113x2 58% 3.83 3.78 3.78 3.74 3.70 0.0056 0.0059 0.0064 0.0074 0.0079
7628x1 48% 4.10 4.05 4.05 4.00 3.95 0.0051 0.0054 0.0059 0.0069 0.0074
254 10 2116x2 56% 3.88 3.83 3.83 3.78 3.73 0.0055 0.0058 0.0063 0.0073 0.0078
305 12 1506x2 47% 4.13 4.08 4.08 4.03 3.98 0.0051 0.0054 0.0059 0.0069 0.0074
381 15 7628x2 45% 4.18 4.13 4.13 4.08 4.03 0.0050 0.0053 0.0058 0.0068 0.0073
461 18 1506x3 47% 4.13 4.08 4.08 4.03 3.98 0.0051 0.0054 0.0059 0.0069 0.0074
510 21 7628*2+ 2113x1 48% 4.10 4.05 4.05 4.00 3.95 0.0051 0.0054 0.0059 0.0069 0.0074
610 24 7628x3 48% 4.10 4.05 4.05 4.00 3.95 0.0051 0.0054 0.0059 0.0069 0.0074
710 28 7628x4 43% 4.22 4.17 4.12 4.07 4.02 0.0049 0.0052 0.0057 0.0067 0.0072
790 31 7628x4 48% 4.10 4.05 4.05 4.00 3.95 0.0051 0.0054 0.0059 0.0069 0.0074
1000 39 7628x5 48% 4.10 4.05 4.05 4.00 3.95 0.0051 0.0054 0.0059 0.0069 0.0074
1200 47 7628x6 48% 4.10 4.05 4.05 4.00 3.95 0.0051 0.0054 0.0059 0.0069 0.0074
2116x11 55% 3.90 3.85 3.85 3.80 3.75 0.0055 0.0058 0.0063 0.0073 0.0078

Press Condition

  • Before feed please baking to remove any absorbed moisture or surface moisture especially for thinner core.A racked bake at 150 ºC for 120 minutes is preferred. 

  • Oxide Alternative is preferred & recommended over the other oxide chemistry for the advanced boards fabrications, especially for lead free and high layer count applications. 
  • Holding time between brown oxide and press process: best control within 24 hours.
250203 VT-464LT PRESS CYCLE.jpg

Typical Drilling Parameters

  • Before feed please baking to remove any absorbed moisture or surface moisture especially for thinner core.A racked bake at 150 ºC for 120 minutes is preferred. 

  • Oxide Alternative is preferred & recommended over the other oxide chemistry for the advanced boards fabrications, especially for lead free and high layer count applications. 
  • Holding time between brown oxide and press process: best control within 24 hours.

Diameter (mm) Spindle Speed (krpm) Feed Rate (mm/sec) Retract Rate (μm/rev) Hit Counts
0.25 145 25 8~13 500
1.0 53 31 30~45 1000

Desmearing Process

• Please test desmear rate and check whether the smear is cleaned clearly by SEM , Ventec could provide the specimen for pilot. • 1 cycle Plasma and 1 cycle desmear or 2 cycles desmear is recommended. • Holding time from desmear to PTH process: < 24 hours

Packaging and Baking Recommendation

  • Before feed please baking to remove any absorbed moisture or surface moisture especially for thinner core.A racked bake at 150 ºC for 120 minutes is preferred. 

  • Oxide Alternative is preferred & recommended over the other oxide chemistry for the advanced boards fabrications, especially for lead free and high layer count applications. 
  • Holding time between brown oxide and press process: best control within 24 hours.

Downloads for tec-speed 4.0H-PK (VT-464LT)