VT-770 / VT-770(LK) Laminate/Prepreg

UL Approval: E214381 Version: 03/02/2025

Storage Condition & Shelf Life

Prepreg Laminate
Storage Condition Temperature Below 23℃ (73℉) Below 5℃ (41℉) Room
Relative Humidity Below 55% / /
Shelf Life 3 Months 6 Months 24 Months (airproof)

Prepreg exceeding shelf life should be retested.

Precautions in Handling

  • The prepreg exceeding shelf time should be retested.
  • Take care in handling thin core laminates as they are easily damaged.
  • If the prepreg is not consumed within 48hrs after opening the vacuum package, it is recommended that the bags be resealed.
  • Material is available in both long and short grain. The grain direction is indicated on the label with an arrow.

 

Designing and Inner Layer Process

  • Please be careful when single ply of 1080, 1086, 1078 or 106 prepreg is designed to the dielectric layer.
  • Baking of material is recommended for stabilization of dimension.
  • In case of thin copper(ex.3μm) with carrier copper foil, the carrier foil should be removed off before baking.
    Baking condition: Temp 200ºC 2 hours;
  • Brown Oxide can be used. In the case of using Black Oxide, please check whether peel strength is acceptable for the usage;
  • Holding time between brown oxide and press process: best control within 6 hours.

Prepreg Availability

E-Glass styles: 2116, 3313, 1078, 1067,1037,1035, etc. Dk values are for impedance design

VT-770

Delivered Thickness (mm) Glass Style Resin Content Dk Df
@ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz
2.0 1037 74% 3.27 3.27 3.23 3.19 3.16 0.003 0.0034 0.0037 0.0039 0.0041
2.4 1067 71% 3.33 3.33 3.27 3.23 3.19 0.003 0.0035 0.0038 0.004 0.0042
2.6 1067 73% 3.28 3.28 3.22 3.18 3.15 0.003 0.0034 0.0037 0.0039 0.0041
2.9 1067 75% 3.25 3.24 3.20 3.16 3.13 0.003 0.0034 0.0037 0.0039 0.0041
3.3 1078 66% 3.40 3.40 3.35 3.31 3.27 0.0031 0.0036 0.0039 0.0041 0.0043
3.5 1078 68% 3.33 3.32 3.26 3.22 3.19 0.003 0.0035 0.0038 0.004 0.0042
4.0 3313 56% 3.48 3.48 3.43 3.39 3.34 0.0033 0.0038 0.0041 0.0043 0.0045
5.0 2116 54% 3.50 3.49 3.45 3.41 3.38 0.0033 0.0038 0.0041 0.0043 0.0045

VT-770(LK)

Delivered Thickness (mm) Glass Style Resin Content DK DF
@ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz
2.1 1035 67% 3.00 2.98 2.95 2.91 2.88 0.0018 0.0020 0.0022 0.0024 0.0026
2.3 1035 71% 2.92 2.90 2.88 2.83 2.80 0.0018 0.0020 0.0022 0.0024 0.0026
2.7 1035 75% 2.85 2.83 2.80 2.75 2.72 0.0017 0.0019 0.0021 0.0023 0.0025
3.0 1078 67% 3.00 2.98 2.95 2.91 2.88 0.0018 0.0020 0.0022 0.0024 0.0026
3.5 1078 71% 2.92 2.90 2.88 2.83 2.80 0.0018 0.0020 0.0022 0.0024 0.0026
3.9 1078 74% 2.87 2.85 2.83 2.78 2.75 0.0017 0.0019 0.0021 0.0023 0.0025
4.2 3313 63% 3.05 3.03 3.00 2.96 2.93 0.0020 0.0022 0.0024 0.0026 0.0028
5.0 2116 59% 3.12 3.10 3.07 3.03 3.00 0.0020 0.0022 0.0024 0.0026 0.0028

Remark: ① Press thickness test condition---Prepreg lamination size 18”*24”, Copper Foil---1oz/1oz, Flow---about 5%; ② Make laminated prepreg to micro-section and measure the thickness with microscope; this thickness is used for resistance design calculation. ③ The thickness measured with micrometer is 0.2~0.4 mil larger than that measured with micro-section; and mainly used for total thickness design calculation.

Laminate Availablity

Dk values are for impedance design

VT-770

Laminate Thickness (mm) Glass Style Piles Resin Content Dk Df
@ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz
1.7 1027 1ply 73% 3.28 3.28 3.22 3.18 3.15 0.003 0.0034 0.0037 0.0039 0.0041
2.0 1067 1ply 65% 3.40 3.40 3.35 3.31 3.27 0.0031 0.0036 0.0039 0.0041 0.0043
2.4 1067 1ply 69% 3.33 3.32 3.26 3.22 3.19 0.0030 0.0035 0.0038 0.0040 0.0042
3.0 1078 1ply 64% 3.42 3.41 3.36 3.33 3.29 0.0031 0.0036 0.0039 0.0041 0.0043
3.5 1078 1ply 68% 3.35 3.35 3.29 3.25 3.21 0.0030 0.0035 0.0038 0.0040 0.0042
4.0 3313 1ply 56% 3.48 3.48 3.43 3.39 3.34 0.0033 0.0038 0.0041 0.0043 0.0045
4.0 1067 2ply 65% 3.40 3.40 3.35 3.31 3.27 0.0031 0.0036 0.0039 0.0041 0.0043
5.0 2116 1ply 54% 3.50 3.49 3.45 3.43 3.38 0.0033 0.0038 0.0041 0.0043 0.0045
5.0 1078 2ply 58% 3.47 3.47 3.42 3.38 3.34 0.0033 0.0037 0.0041 0.0043 0.0045
6.0 1078 2ply 63% 3.44 3.44 3.39 3.35 3.31 0.0031 0.0036 0.0039 0.0041 0.0043
8.0 3313 2ply 56% 3.48 3.48 3.43 3.39 3.34 0.0033 0.0038 0.0041 0.0043 0.0045
12.0 3313 3ply 56% 3.48 3.48 3.43 3.39 3.34 0.0033 0.0038 0.0041 0.0043 0.0045

More types could be available upon request.

VT-770(LK)

Laminate Thickness (mm) Glass Type Piles Resin Content Dk Df
@ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz @ 1GHz @ 2GHz @ 5GHz @ 10GHz @ 20GHz
2.0 1067 1ply 69% 2.95 2.93 2.90 2.85 2.82 0.0018 0.0020 0.0022 0.0024 0.0026
2.6 1078 1ply 65% 3.05 3.03 3.00 2.96 2.93 0.0019 0.0021 0.0023 0.0025 0.0027
2.6 1037 2ply 65% 3.05 3.03 3.00 2.96 2.93 0.0019 0.0021 0.0023 0.0025 0.0027
3.0 1078 1ply 67% 3.00 2.98 2.95 2.91 2.88 0.0018 0.0020 0.0022 0.0024 0.0026
4.0 3313 1ply 60% 3.10 3.08 3.05 3.01 2.98 0.0020 0.0022 0.0024 0.0026 0.0028
4.0 1067 2ply 69% 2.95 2.93 2.90 2.85 2.82 0.0018 0.0020 0.0022 0.0024 0.0026
4.5 3313 1ply 63% 3.05 3.03 3.00 2.96 2.93 0.0020 0.0022 0.0024 0.0026 0.0028
4.5 1067 2ply 72% 2.92 2.90 2.88 2.83 2.80 0.0018 0.0020 0.0022 0.0024 0.0026
5.0 2116 1ply 58% 3.12 3.10 3.07 3.03 3.00 0.0020 0.0022 0.0024 0.0026 0.0028
5.0 1067 2ply 75% 2.85 2.83 2.80 2.75 2.72 0.0017 0.0019 0.0021 0.0023 0.0025
6.0 1078 2ply 67% 3.00 2.98 2.95 2.91 2.88 0.0018 0.0020 0.0022 0.0024 0.0026
8.0 3313 2ply 60% 3.10 3.08 3.05 3.01 2.98 0.0020 0.0022 0.0024 0.0026 0.0028
10.0 2116 2ply 58% 3.12 3.10 3.07 3.03 3.00 0.0020 0.0022 0.0024 0.0026 0.0028

More types could be available upon request.

Press Condition

1. Heating rate (Rate of Rise) of material [Material Temperature]: Programmable Press: ≥3ºC/min

2. Curing Temperature & Time: >120min at more than 210ºC and peak temperature>215 ºC

3. Full Pressure: ≥400psi (28Kg/cm2) should be applied full pressure before 100 ºC

4. Vacuuming should be continued until over 140ºC [Material Temperature]

5. Cushion for pressure evenness is needed

VT-770 770LK PressCycle.jpg

Typical Drilling Parameters

  • Drilling parameters should be adjusted depending on hole size, layer count, panel thickness, stack count and stack height etc.
  • Please adjust drilling parameters after checking qualities of through holes.
  • Suggest Drilling parameter as below:

 

Diameter (mm) Spindle Speed (krpm) Feed Rate (IPM) Chip Load (IPM) Hit Counts
0.10 200~300 25~38 800 1000
0.20 150~200 38~50 800 1000
0.30 100~150 38~60 800 1000
0.40 80~100 40~50 800 1000

Smear, resin cracking or nail heading may occur if drilling condition doesn’t match material.

Desmearing Process

  • The weight loss of VT-770 &VT-770(LK) is less than as our conventional FR-4 material.
  • We recommend a plasma cycle and a vertical permanganate cycle together to adequately prepare the hole walls for plating
    (If used by horizontal desmear, it should be need twice cycles).
  • Plasma Desmear Parameter
    One time of FR-4 conditions is recommendable.
  • Permanganate Desmear Parameter
    Twice of FR-4 horizontal desmear condition is recommendable, or one time of FR-4 vertical desmear condition is recommendable.
  • Typical Permanganate Desmear parameter by Atotech chemical as below:

Process Reagent Type Temperature ℃ Duration (min)
Sewll Alkaline 60-70 5-10
Etching Permanganate 70-80 10-15

Please consult the chemical supplier for suggested conditions.

Packaging and Baking Recommendation

  • It is recommended to bake the board before packaging at 125ºC/4~8h to avoid moisture causing a decrease in heat resistance.
  • If the PCBs needs to be stored for a long time before use, it is recommended to use aluminum foil vacuum packaging.
  • If exceed 3 months after packaging , It is best to bake the PCBs at 125ºC/4~6h before assembly before use.

 

Downloads for tec-speed 6.0/6.1 H-PK (VT-770 / VT-770LK)